30PCS Thermal Silicone Films 15x15x1mm, Soft Silicone Thermal Pads for Heat Dissipation in Laptop CPUs and Devices

30PCS Thermal Silicone Films 15x15x1mm Soft Silicone Thermal Pads for Heat Dissipation of IC Chipsets in Laptop CPUs Lighting Fixtures and Heat Transfer Devices

30PCS Thermal Silicone Films 15x15x1mm, Soft Silicone Thermal Pads for Heat Dissipation in Laptop CPUs and Devices

Thermally Conductive Silicone Pad Size: 15mm x 15mm x 1mm/0.59inch x 0.59inch x 0.04inch. Thermally conductive silicone sheet is made of thermally conductive raw materials and monocrystalline silicon rubber raw materials and other materials After high temperature vulcanization molding sheet, roll thermal conductive material. It has high insulation, compression, natural adhesive surface and a certain degree of flexibility and excellent thermal conductivity. Designed for the use of gap heat transfer design program production, can fill the gap, complete the heat-generating components and heat dissipation parts of the heat transfer between the parts, but also play a role in insulation, vibration damping, sealing, etc., to meet the miniaturization of the equipment and the ultra-thin design requirements, is a great craftsmanship and operability, and the thickness of the adaptive range of a good thermal conductivity of the filler material. Widely used in laptop computers, cpu, lamps and other equipment that require heat dissipation and thermal conductivity.

Key Features

• ✅ Thermally conductive silicone sheet is made of thermally conductive raw materials and monocrystalline silicon rubber raw materials and other materials after high temperature vulcanization molding sheet, roll thermal conductive materials.
• ✅ Size: 15mm x 15mm x 1mm/0.59inch x 0.59inch x 0.04inch.
• ✅ It has high insulation, compression, natural adhesive surface and certain flexibility and excellent thermal conductivity.
• ✅ Designed for the use of gap heat transfer design program production, can fill the gap, complete the heat transfer between the heat-generating components and heat dissipation parts, but also play a role in insulation, shock absorption, sealing, etc., to meet the equipment miniaturization and ultra-thin design requirements, is a great craftsmanship and operation, and the thickness of the wide range of adaptability is a kind of excellent thermal conductivity of the filler material.
• ✅ Widely used in laptop computers, cpu, lamps and other devices that require heat dissipation and heat conduction.

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